FCCSP
Production Information
Features
- Package Size: 3 x 3 mm up to 15 x 15 mm
- Line & Space 15/15 um
- Bump Pitch down to 140 um
- Impedance control for critical signal traces
- Structure range from 2 layers to 8 layers
- For products demanding high density and reliability
- For small package size with high electric performance product
Benefits
- High I/O Count and Short Interconnects
- High layout density
- Cost reduction due to smaller package size
Applications
- Hand-held, Mobile, Networking
- Smart phone, Consumer electronics and DTV